TEC1-19908 24V/8A High-power Semiconductor Refrigeration Plate

1. Chip model: TEC1-19908SR
2. Temperature difference: 65 degrees Celsius
3. Voltage: 24V (MAX)
4. Assembly pressure: 85N/cm2
5. Current: 8A (MAX)
6. Working environment: Temperature range -55~83 degrees Celsius (excessive ambient temperature will directly affect the refrigeration efficiency)
7. Packaging process: epoxy resin sealing
8. A radiator or water-cooled heat dissipation device must be installed on the heat dissipation surface, otherwise it will burn.
9. Device characteristics: red line positive electrode, black line negative electrode (literally the refrigeration surface, non-literally the heat dissipation surface)
10. When testing without heat dissipation, there will be a cooling effect. If the power is turned on, the power supply should be unplugged immediately within 1 second, otherwise the refrigeration plate will be easily burned.
11. Note: No matter whether it is water-cooled or air-cooled, thermal silicone grease must be applied
12. Wire specification: lead length 290mm
13. Dimensions: 40x40x3.4mm