RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping

The RELIFE TO6 is a solder mopping pin set designed for cell phone motherboard repair. It features a pure copper gold-plated needle for efficient soldering.

• Product type: Electric Soldering Iron
• Material: Copper
• Compatibility: Cell Phone Motherboard
• Key feature: Pure copper gold-plated needle
• Tinning speed increased by 50%
• Ball head design for deep access into gaps
• Contains 5 tin dragging pins
• Can be operated in small spaces
• Suitable for motherboard maintenance tin drag
• Especially suitable for BGA package chip tin drag
• Handle size: 11.8 x 0.8 cm
• Needle size: 2 x 0.12 cm
• Net weight: 21.4 g