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RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping

RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping

SKU: TBD0606459901
Precio habitual $24.00
Precio habitual Precio de oferta $24.00
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In Stock Ships from CHN This item is dispatched from our fulfilment centre in China.

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Product Details

Brand: RELIFE

The RELIFE TO6 is a solder mopping pin set designed for cell phone motherboard repair. It features a pure copper gold-plated needle for efficient soldering.

  • Product type: Electric Soldering Iron
  • Material: Copper
  • Compatibility: Cell Phone Motherboard
  • Key feature: Pure copper gold-plated needle
  • Tinning speed increased by 50%
  • Ball head design for deep access into gaps
  • Contains 5 tin dragging pins
  • Can be operated in small spaces
  • Suitable for motherboard maintenance tin drag
  • Especially suitable for BGA package chip tin drag
  • Handle size: 11.8 x 0.8 cm
  • Needle size: 2 x 0.12 cm
  • Net weight: 21.4 g

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$24.00