Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
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UK orders under £135 incur no additional fees. Otherwise, duties are only included if shown at checkout — your local government may apply customs fees, which your courier will collect directly from you before delivery.
Processed in 1–3 business days
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Fast refunds: Once we receive and inspect your return, your refund is processed to your original payment method within 5 business days.
Return postage: Just changed your mind? You'll need to cover the return postage. If the item arrived faulty, we'll cover the cost to get it back to us.
The Kaisi 4pcs Solder Paste Stencil is designed for reballing BGA unit chips in mobile phones. It is made from stainless steel and features a multi-purpose steel mesh.
- Product type: BGA Stencils
- Compatibility: mobile phones
- Material: stainless steel
- Key feature: multi-purpose steel mesh
- Color/Variant: silver
- Intended use: reballing
- Durable and long-lasting
- Resistant to high temperatures and wear and tear
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