BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb
BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb
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BAKU BK-5051 BGA Solder Paste is designed for BGA and SMT applications in electronics repair. It provides excellent thermal conductivity and stable melting performance.
- Product type: Soldering Paste
- Brand: BAKU
- Compatibility: BGA and SMT applications
- Material: 63Sn/37Pb alloy
- Key feature: No-Clean, Low-Residue
- Color/Variant: Tin
- Intended use: Electronics repair
- Category: Soldering Tools & Accessories
- Particle size: 25-45μm
- Halide-free materials
- Minimal post-welding residue
- Advanced Membrane Removal Technology
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