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BGA Stencils

Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

SKU: TBD0606276401
$28.00
$28.00
Sale Ausverkauft
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In Stock Ships from CHN This item is dispatched from our fulfilment centre in China.

Processed in 1–3 calendar days

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Product details

Brand
Kaisi
Category
BGA Stencils

The Kaisi 4pcs Solder Paste Stencil is designed for reballing BGA unit chips in mobile phones. It is made from stainless steel and features a multi-purpose steel mesh.

  • Product type: BGA Stencils
  • Compatibility: mobile phones
  • Material: stainless steel
  • Key feature: multi-purpose steel mesh
  • Color/Variant: silver
  • Intended use: reballing
  • Durable and long-lasting
  • Resistant to high temperatures and wear and tear