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Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
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Normaler Preis
$26.00
Normaler Preis
Verkaufspreis
$26.00
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Processing time: 1 - 3 days
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The Kaisi 4pcs Solder Paste Stencil is designed for reballing BGA unit chips in mobile phones. It is made from stainless steel and features a multi-purpose steel mesh.
- Product type: BGA Stencils
- Compatibility: mobile phones
- Material: stainless steel
- Key feature: multi-purpose steel mesh
- Color/Variant: silver
- Intended use: reballing
- Durable and long-lasting
- Resistant to high temperatures and wear and tear
SKU:TBD0606276401
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