BAKU BK-5050 150g BGA Solder Paste Flux for Mobile Phone & Computer Motherboard Repair

BAKU BK-5050 is a solder paste designed for electronics repair. It is suitable for mobile phones and computer motherboards.

• Product type: Soldering Paste
• Material: 63% tin and 37% lead alloy
• Key feature: No-clean, low-residue efficiency
• Color/Variant: 150g
• Compatibility: Mobile phones and computers
• Intended use: Electronics repair
• Halide-free materials and no harmful additives
• Complies with environmental safety standards
• Minimal post-welding residue
• Particle size: 25-45μm
• Advanced Membrane Removal Technology
• Improves solder joint brightness, adhesion, and conductivity