1
/
de
5
No reviews
Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
SKU: TBD0606276401
Prix habituel
£13.70
Prix habituel
Prix promotionnel
£13.70
Frais d'expédition calculés à l'étape de paiement.
Free Shipping Tracked
In Stock
•
Processing time: 1 - 3 days
Quantité
Impossible de charger la disponibilité du service de retrait
The Kaisi 4pcs Solder Paste Stencil is designed for reballing BGA unit chips in mobile phones. It is made from stainless steel and features a multi-purpose steel mesh.
- Product type: BGA Stencils
- Compatibility: mobile phones
- Material: stainless steel
- Key feature: multi-purpose steel mesh
- Color/Variant: silver
- Intended use: reballing
- Durable and long-lasting
- Resistant to high temperatures and wear and tear
Have questions about this product? Need help choosing? Contact our support team for assistance!
Partager

£13.70