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BGA Stencils

Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

SKU: TBD0606276401
Prix habituel £13.70
Prix habituel Prix promotionnel £13.70
Promotion Épuisé
Frais d'expédition calculés à l'étape de paiement.
In Stock Ships from CHN This item is dispatched from our fulfilment centre in China.

Processed in 1–3 calendar days

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Product details

The Kaisi 4pcs Solder Paste Stencil is designed for reballing BGA unit chips in mobile phones. It is made from stainless steel and features a multi-purpose steel mesh.

  • Product type: BGA Stencils
  • Compatibility: mobile phones
  • Material: stainless steel
  • Key feature: multi-purpose steel mesh
  • Color/Variant: silver
  • Intended use: reballing
  • Durable and long-lasting
  • Resistant to high temperatures and wear and tear