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Soldering Paste

BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb

BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb

SKU: TBD06060299
£13.40
£13.40
Promotion Épuisé
Frais d'expédition calculés à l'étape de paiement.
In Stock Ships from CHN This item is dispatched from our fulfilment centre in China.

Processed in 1–3 calendar days

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Product details

Brand
BAKU

BAKU BK-5051 BGA Solder Paste is designed for BGA and SMT applications in electronics repair. It provides excellent thermal conductivity and stable melting performance.

  • Product type: Soldering Paste
  • Brand: BAKU
  • Compatibility: BGA and SMT applications
  • Material: 63Sn/37Pb alloy
  • Key feature: No-Clean, Low-Residue
  • Color/Variant: Tin
  • Intended use: Electronics repair
  • Category: Soldering Tools & Accessories
  • Particle size: 25-45μm
  • Halide-free materials
  • Minimal post-welding residue
  • Advanced Membrane Removal Technology