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BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point

BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point

SKU: TBD06060300
$25.00
$25.00
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In Stock • Processing time: 1 - 3 days

BAKU BA-5052 BGA Solder Paste is designed for mobile phone repair and precision electronics assembly. It provides strong adhesion and extensibility for effective soldering.

  • Product type: Soldering Paste
  • Brand: BAKU
  • Compatibility: mobile phone repair
  • Material: Lead-free
  • Key feature: Strong adhesion and extensibility
  • Color/Variant: 35g
  • Intended use: Precision electronics assembly
  • Category: Soldering Tools & Accessories
  • Particle Size: 35-45 microns
  • Melting Point: 138 degrees Celsius
  • Recommended Temperature: 160–170 degrees Celsius
  • Net Weight: 35g

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$25.00