BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb

BAKU BK-5051 BGA Solder Paste is designed for BGA and SMT applications in electronics repair. It provides excellent thermal conductivity and stable melting performance.

• Product type: Soldering Paste
• Brand: BAKU
• Compatibility: BGA and SMT applications
• Material: 63Sn/37Pb alloy
• Key feature: No-Clean, Low-Residue
• Color/Variant: Tin
• Intended use: Electronics repair
• Category: Soldering Tools & Accessories
• Particle size: 25-45μm
• Halide-free materials
• Minimal post-welding residue
• Advanced Membrane Removal Technology