BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point
BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point
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BAKU BA-5052 BGA Solder Paste is designed for mobile phone repair and precision electronics assembly. It provides strong adhesion and extensibility for effective soldering.
- Product type: Soldering Paste
- Brand: BAKU
- Compatibility: mobile phone repair
- Material: Lead-free
- Key feature: Strong adhesion and extensibility
- Color/Variant: 35g
- Intended use: Precision electronics assembly
- Category: Soldering Tools & Accessories
- Particle Size: 35-45 microns
- Melting Point: 138 degrees Celsius
- Recommended Temperature: 160–170 degrees Celsius
- Net Weight: 35g
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