BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point

BAKU BA-5052 BGA Solder Paste is designed for mobile phone repair and precision electronics assembly. It provides strong adhesion and extensibility for effective soldering.

• Product type: Soldering Paste
• Brand: BAKU
• Compatibility: mobile phone repair
• Material: Lead-free
• Key feature: Strong adhesion and extensibility
• Color/Variant: 35g
• Intended use: Precision electronics assembly
• Category: Soldering Tools & Accessories
• Particle Size: 35-45 microns
• Melting Point: 138 degrees Celsius
• Recommended Temperature: 160–170 degrees Celsius
• Net Weight: 35g