Qty
Product details
The RELIFE TO6 is a solder mopping pin set designed for cell phone motherboard repair. It features a pure copper gold-plated needle for efficient soldering.
- Product type: Electric Soldering Iron
- Material: Copper
- Compatibility: Cell Phone Motherboard
- Key feature: Pure copper gold-plated needle
- Tinning speed increased by 50%
- Ball head design for deep access into gaps
- Contains 5 tin dragging pins
- Can be operated in small spaces
- Suitable for motherboard maintenance tin drag
- Especially suitable for BGA package chip tin drag
- Handle size: 11.8 x 0.8 cm
- Needle size: 2 x 0.12 cm
- Net weight: 21.4 g