MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning

The MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste is a soldering paste designed for mobile phone repairs. It is lead-free and halogen-free, making it environmentally friendly.

• Product type: Soldering Paste
• Material: Lead-free, halogen-free
• Key feature: Environmentally friendly
• Color/Variant: No Lead / Halogen Flux
• Intended use: Everyday use
• Category: Soldering Tools & Accessories
• Less smoke and less odor
• Bright solder joints, no resistance, non-conductive
• Less residue, good flow performance
• No short circuit, no need to clean, infinite conductivity
• Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding
• Weight: about 20g
• Size: about 12.7 x 2.9cm